Fabrication process of µUV LED display

The µUV LED chip that has been batch-transferred (die-bonded) to the TFT substrate is removed from the sapphire substrate for the epi-growth by laser lift-off (LLO). The LLO success rate in this process has reached nearly 100%.

µUV LED chip arrangement and emission image

Image: Provided by V Technology Co., Ltd.

Next, apply red, green and blue phosphors onto the µUV LED chip that has been transferred to the substrate. In the image below, it can be seen the even emission. The conversion efficiency of the phosphor is 40-90%.

Emission by µUV LED + RGB color conversion layer

Image: Provided by V Technology Co., Ltd.